JPH0739615Y2 - 樹脂モールド装置 - Google Patents
樹脂モールド装置Info
- Publication number
- JPH0739615Y2 JPH0739615Y2 JP11486089U JP11486089U JPH0739615Y2 JP H0739615 Y2 JPH0739615 Y2 JP H0739615Y2 JP 11486089 U JP11486089 U JP 11486089U JP 11486089 U JP11486089 U JP 11486089U JP H0739615 Y2 JPH0739615 Y2 JP H0739615Y2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- pot
- resin molding
- resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 21
- 229920005989 resin Polymers 0.000 title claims description 21
- 238000000465 moulding Methods 0.000 title claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 101100298225 Caenorhabditis elegans pot-2 gene Proteins 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11486089U JPH0739615Y2 (ja) | 1989-09-29 | 1989-09-29 | 樹脂モールド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11486089U JPH0739615Y2 (ja) | 1989-09-29 | 1989-09-29 | 樹脂モールド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0352119U JPH0352119U (en]) | 1991-05-21 |
| JPH0739615Y2 true JPH0739615Y2 (ja) | 1995-09-13 |
Family
ID=31663208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11486089U Expired - Lifetime JPH0739615Y2 (ja) | 1989-09-29 | 1989-09-29 | 樹脂モールド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739615Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4607478B2 (ja) * | 2004-03-17 | 2011-01-05 | 株式会社トクホン | 貼付剤用両面離型フィルム |
-
1989
- 1989-09-29 JP JP11486089U patent/JPH0739615Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0352119U (en]) | 1991-05-21 |
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